Electronic package structure

ABSTRACT

The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation-in-part of U.S. patent applicationSer. No. 12/971,671 filed on Dec. 17, 2010, now U.S. Pub. No.2011/0090648, which is a divisional of U.S. patent application Ser. No.12/143,143 filed on Jun. 20, 2008, now U.S. Pub. No. 2009/0207574, nowabandoned, which claims priority of Taiwan application Ser. No. 97105555filed on Feb. 18, 2008. The entirety of the above-mentioned patentapplications are hereby incorporated by reference herein and made a partof specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a package structure. More particularly,the present invention relates to an electronic package structure.

2. Description of Related Art

Electronic package structures are formed by complicated packageprocesses. Different electronic package structures have differentelectrical performances and capacities of heat dissipation, andtherefore a designer may select an electronic package structure with adesired electrical performance and capacity of heat dissipationaccording to a design requirement.

FIG. 1 is a schematic diagram of a conventional electronic packagestructure. Referring to FIG. 1, the conventional electronic packagestructure 100 includes a printed circuit board (PCB) 110 and a pluralityof electronic elements 120. The electronic elements 120 are disposed ona surface 112 of the PCB 110 and electrically connected to the PCB 110.The PCB 110 has a plurality of pins 116 extending out from anothersurface 114 of the PCB 110 to be electrically connected to an electronicdevice, for example, a motherboard (not shown).

FIG. 2 is a schematic diagram of another conventional electronic packagestructure. Referring to FIG. 2, the conventional electronic packagestructure 200 includes a circuit substrate 210 and a plurality ofelectronic elements 220. The electronic elements 220 are disposed on asurface 212 of the circuit substrate 210, and electrically connected tothe circuit substrate 210 via a wire bonding technology, a flip-chipbonding technology or a surface mount technology. Moreover, theconventional electronic package structure 200 may be electricallyconnected to an electronic device, for example, a motherboard (notshown), via a solder paste or a plurality of solder balls (not shown).

It should be noted that the electronic elements 120 of the conventionalelectronic package structure 100 are all disposed on the surface 112 ofthe PCB 110, and the electronic elements 220 of the conventionalelectronic package structure 200 are all disposed on the surface 212 ofthe circuit substrate 210. Therefore, in the conventional electronicpackage structures 100 and 200, spatial utilization of the PCB 110 andthe circuit substrate 210 is relatively low, and sizes of theconventional electronic package structures 100 and 200 are relativelygreat.

SUMMARY OF THE INVENTION

In accordance with the present invention, an electronic packagestructure can achieve a relatively high utilization of an internal spacethereof, so that a size of the electronic package structure can bereduced.

In one embodiment of the present invention, an electronic packagestructure is provided. The body has a top surface with a cavity thereon,a first conductive element is disposed in the cavity, and a secondconductive element is disposed in the body. A first external electrodeelectrically connected to the first conductive element and the secondexternal electrode electrically connected to the second conductiveelement are both disposed on the top surface of the body or a firstsurface formed by the top surface of the encapsulation compound and theexposed portions of the top surface of the body which are not covered bythe encapsulation compound. Because the first conductive element isdisposed in the cavity of the body in the electronic package structure,space in the electronic package structure can be used more efficientlycompared with the conventional electronic package structures,

In order to make the aforementioned and other objects, features andadvantages of the present invention comprehensible, a preferredembodiment accompanied with figures is described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a conventional electronic packagestructure.

FIG. 2 is a schematic diagram of another conventional electronic packagestructure.

FIG. 3A is a schematic diagram of an electronic package structureaccording to a first embodiment of the present invention.

FIG. 3B is a schematic diagram of another electronic package structureaccording to the first embodiment of the present invention.

FIG. 3C is a schematic diagram of another electronic package structureaccording to the first embodiment of the present invention.

FIG. 3D is a schematic diagram of still another electronic packagestructure according to the first embodiment of the present invention.

FIG. 4A is a schematic diagram of an electronic package structureaccording to a second embodiment of the present invention.

FIG. 4B is a schematic diagram of another electronic package structureaccording to the second embodiment of the present invention.

FIG. 5A is a schematic diagram of an electronic package structureaccording to a third embodiment of the present invention.

FIG. 5B is a schematic diagram of another electronic package structureaccording to the third embodiment of the present invention.

FIG. 6A to FIG. 6D illustrate a schematic cross-sectional view of anelectronic package structure in which a first external electrode and asecond external electrode are disposed on the top surface of the body inthe electronic package structure.

DESCRIPTION OF EMBODIMENTS

First Embodiment

FIG. 3A is a schematic diagram of an electronic package structureaccording to a first embodiment of the present invention. Referring toFIG. 3A, the electronic package structure 300 includes at least onefirst electronic element 310 (two first electronic elements areillustrated in FIG. 3A), a second electronic element 320 and a firstlead frame 330. The electronic package structure 300 is generallyapplied to a voltage regulator module, a network adapter, a graphicsprocessing unit, a DC/DC converter or a point-of-load (POL) converter.Each of the first electronic elements 310 can be a logical controlelement, a driving element or a passive element. The passive element canbe a capacitor, an inductor with lesser inductance, or a resistor. Eachof the first electronic elements 310 can also be a power element, suchas a metal-oxide-semiconductor field effect transistor (MOSFET), aninsulated gate bipolar transistor (IGBT) or a diode.

The second electronic element 320 includes a body 322 having a cavity322 a. The first electronic elements 310 are disposed in the cavity 322a. In the embodiment, the body 322 of the second electronic element 320has a first surface 322 b, a second surface 322 c opposite to the firstsurface 322 b and a side surface 322 d. The cavity 322 a sinks in adirection from the second surface 322 c towards the first surface 322 b.The side surface 322 d connects the first surface 322 b and the secondsurface 322 c. Besides, the second electronic element 320 can be anenergy-storage element used for storing electric energy. In detail, thesecond electronic element 320 further includes a coil 324 and aplurality of first external electrodes 326. The coil 324 is disposedwithin the body 322. The first external electrodes 326 are respectivelyconnected to two opposite ends of the coil 324, and extend outside thebody 322 to locate on the first surface 322 b and the side surface 322d. The body 322 comprising a magnetic body encloses the coil 324. Thesecond electronic element 320 can be an inductive element with a greaterinductance and a greater size than the first electronic elements 310.

The first lead frame 330 has a plurality of leads 332. Each of the leads332 has a first end 332 a and a second end 332 b, and the first end 332a of each of the leads 332 can be embedded in the body 322 and extendsto the cavity 322 a for electrically connecting to the first electronicelements 310. The second end 332 b of each of the leads 332 is disposedon the first surface 322 b of the body 322 to form a second externalelectrode 332 c, and a part of each of the leads 332 connecting thefirst end 332 a and the second end 332 b is disposed on the side surface322 d of the body 322.

In the present embodiment, the electronic package structure 300 furtherincludes a circuit substrate 340 and an insulating encapsulant 350. Thecircuit substrate 340 is disposed in the cavity 322 a of the body 322.The first electronic elements 310 can be disposed on the circuitsubstrate 340 and electrically connected to the circuit substrate 340.The circuit substrate 340 is electrically connected to the first end 332a of each of the leads 332 extending to the cavity 322 a. The firstelectronic elements 310 may be electrically connected to the circuitsubstrate 340 via a wire bonding technology, a flip-chip bondingtechnology or a surface mount technology. The circuit substrate 340 hasa first circuit layer 342, a second circuit layer 344, a dielectriclayer 346 disposed between the first circuit layer 342 and the secondcircuit layer 344, and at least a conductive channel 348. The firstelectronic elements 310 are disposed on the first circuit layer 342, andthe conductive channel 348 penetrates the dielectric layer 346 forelectrically connecting the first circuit layer 342 and the secondcircuit layer 344. It should be noted that the circuit board 340 of theelectronic package structure 300 may be omitted according to a designrequirement of a designer, though it is not illustrated.

Moreover, the insulating encapsulant 350 is disposed in the cavity 322 aand encapsulates the first electronic elements 310 and the circuitsubstrate 340 for protecting the first electronic elements 310 and thecircuit substrate 340, and enhancing a whole mechanical strength of theelectronic package structure 300.

Since the first electronic elements 310 and the circuit substrate 340are disposed in the cavity 322 a of the second electronic element 320,compared to a conventional electronic package structures of FIG. 1 andFIG. 2, utilization of an internal space of the electronic packagestructure 300 is relatively high, and the first electronic elements 310and the circuit substrate 340 can be protected by the cavity 322 a.

Besides, since the insulating encapsulant 350 is disposed in the cavity322 a, material of the insulating encapsulant 350 can be directly filledinto the cavity 322 a without aiding of extra mold during formation ofthe insulating encapsulant 350.

FIG. 3B is a schematic diagram of another electronic package structureaccording to the first embodiment of the present invention. Referring toFIG. 3A and FIG. 3B, a difference between the electronic packagestructure 300′ and the electronic package structure 300 is that a partof each lead 332′ connecting a first end 332 a′ and a second end 332 b′penetrates a body 322′. Besides, the insulating encapsulant 350 of theelectronic package structure 300 is different from a magneticencapsulant 350′ of the electronic package structure 300′. The magneticencapsulant 350′ is disposed in a cavity 322 a′ of the body 322′.Therefore, if a second electronic element 320′ is an inductive element,an inductive characteristic of the second electronic element 320′influenced by the cavity 322′ then can be compensated by the magneticencapsulant 350′. It should be noted that a part of each of the leads332 connecting the first end 332 a and the second end 332 b may alsopenetrate the body 322 according to a design requirement, though it isnot illustrated.

FIG. 3C is a schematic diagram of another electronic package structureaccording to the first embodiment of the present invention. Referring toFIG. 3A and FIG. 3C, a difference between the electronic packagestructure 300″ and the electronic package structure 300 is that a cavity322 a″ of a body 322″ sinks in a direction from a first surface 322 b″towards a second surface 322 c″. It should be noted that an insulatingencapsulant 350″ can be substituted by a magnetic encapsulant accordingto a design requirement, and a part of each lead 332″ connecting a firstend 332 a″ and a second end 332 b″ may also penetrate the body 322″according to a design requirement, though it is not illustrated.

FIG. 3D is a schematic diagram of still another electronic packagestructure according to the first embodiment of the present invention.Referring to FIG. 3A and FIG. 3D, a second lead frame 360 is applied inthe electronic package structure 300″ for substituting the circuitsubstrate 340 of the electronic package structure 300 according to adesign requirement. A plurality of first electronic elements 310″ aredisposed on the second lead frame 360 and electrically connected to thesecond lead frame 360. The second lead frame 360 is electricallyconnected to a first end 332 a″ of each lead 332″ of a first lead frame330″ that extends to a cavity 322 d″.

Second Embodiment

FIG. 4A is a schematic diagram of an electronic package structureaccording to a second embodiment of the present invention. Referring toFIG. 4A and FIG. 3A, a difference between the electronic packagestructure 400 of the second embodiment and the electronic packagestructure 300 of the first embodiment is that a body 422 of a secondelectronic element 420 does not have the cavity 322 a. In detail, afirst end 432 a of each lead 432 of a lead frame 430 is disposed on afirst surface 422 a of a body 422, and a plurality of first electronicelements 410 are disposed on the first surface 422 a and electricallyconnected to the leads 432. Moreover, a second end 432 b of each of theleads 432 is disposed on a second surface 422 b of the body 422 oppositeto the first surface 422 a, and a part of each of the leads 432connecting the first end 432 a and the second end 432 b is disposed on aside surface 422 c of the body 422.

Furthermore, a circuit substrate 440 is disposed on the first surface422 a and electrically connected to the leads 432, and the firstelectronic elements 410 are disposed on the circuit substrate 440 andelectrically connected to the circuit substrate 440. It should be notedthat the circuit substrate 440 of the electronic package structure 400may be omitted according to a design requirement of the designer, or thecircuit substrate 440 may be substituted by a lead frame, though it isnot illustrated.

FIG. 4B is a schematic diagram of another electronic package structureaccording to the second embodiment of the present invention. Referringto FIG. 4A and FIG. 4B, a difference between the electronic packagestructure 400′ and the electronic package structure 400 is that a partof each lead 432′ connecting a first end 432 a′ and a second end 432 b′penetrates a body 422′.

Third Embodiment

FIG. 5A is a schematic diagram of an electronic package structureaccording to a third embodiment of the present invention. Referring toFIG. 5A, in the electronic package structure 500 of the presentembodiment, a plurality of first electronic elements 510 are disposed ona first surface 532 of a circuit substrate 530 and electricallyconnected to the circuit substrate 530. A second electronic element 520is disposed above the first surface 532 of the circuit substrate 530.The first electronic elements 510 are located between a body 522 of thesecond electronic element 520 and the first surface 532 of the circuitsubstrate 530, and the first electronic elements 510 are located betweenleads 524 of the second electronic element 520. In other words, in thepresent embodiment, the second electronic element 520 covers the firstelectronic elements 510. Besides, an insulating encapsulant 540 isdisposed between the second electronic element 520 and the circuitsubstrate 530 and encapsulating the first electronic elements 510 forprotecting the first electronic elements 510 and enhancing a wholemechanical strength of the electronic package structure 500. Moreover,the circuit substrate 530 may further include at least a conductivechannel 539, and each of the conductive channels 539 penetrates adielectric layer 538 for electrically connecting a first circuit layer534 and a second circuit layer 536. At least one of the conductivechannels 539 (for example, the two conductive channels 539 located at aleft side of FIG. 5A) is located below at least one of the firstelectronic elements 510 (for example, the first electronic element 510located at the left side of

FIG. 5A), so that heat generated by the first electronic element 510located at the left side may be quickly transmitted to where is outsidethe electronic package structure 500 via the two conductive channels 539located at the left side. A second end 524 b of each of the leads 524 ofthe second electronic element 520 extends out from the body 522 toelectrically connect the circuit substrate 530. The second electronicelement 520 may be an inductive element including a coil 526. The body522 which is a magnetic wrap wraps the coil 526, and a first end 524 aof each of the leads 524 is connected to one of two opposite ends of thecoil 526.

It should be noted that the electronic package structure 500 furtherincludes an electromagnetic-interference-shielding element(EMI-shielding element) 550 covering the first electronic elements 510.In the present embodiment, the EMI-shielding element 550 is disposed onthe body 522 of the second electronic element 520, and is locatedbetween the body 522 of the second electronic element 520 and thecircuit substrate 530. Therefore, during operation of the electronicpackage structure 500, it may be reduced by means of the EMI-shieldingelement 550 that electrical signals transmitted in the circuit substrate530 is interfered by a magnetic force generated by the second electronicelement 520 which functions as an inductive element.

FIG. 5B is a schematic diagram of another electronic package structureaccording to the third embodiment of the present invention. Referring toFIG. 5A and FIG. 5B, a difference between the electronic packagestructure 500′ and the electronic package structure 500 is that anEMI-shielding element 550′ of the electronic package structure 500′ isdisposed in a cavity 522′ of a second electronic element 520′.

Fourth Embodiment

Fourth embodiment discloses an electronic package structure in which afirst external electrode and a second external electrode are disposed onthe top surface of the body in the electronic package structure (SeeFIG. 6A to 6D. It can be also seen in reversed FIG. 3C). In oneembodiment, an encapsulation compound has a top surface disposed in thecavity to encapsulate the first conductive element, wherein the topsurface of the encapsulation compound and the exposed portions of thetop surface of the body which are not covered by the encapsulationcompound form a first surface, and the first external electrode and thesecond external electrode are disposed on the first surface. The firstexternal electrode and the second external electrode can be patterned onthe top surface of the body by known methods, such as lithographyprocess or printing process.

FIG. 6A illustrates a schematic cross-sectional view of example 1.Structure in Example 1 mainly comprises a first conductive element 610,a first external electrode 632 c, a body 622, a second conductiveelement 624 and a second external electrode 626. The first externalelectrode 632 c and the second external electrode 626 are disposed onthe top surface 622 c of the body 622 in the electronic packagestructure 600. The body 622 comprises a cavity 622 a on the top surface622 c of the body 622, and the first conductive element 610 is disposedin the cavity 622 a. The second conductive element 624, such as a coil,a choke or an inductor, is disposed within the body 622. In oneembodiment, the second conductive element 624 can be enclosed by thebody 622. The body 622 can be made of a magnetic material. The body 622can comprise a magnetic wrap wrapping the second conductive element 624.

In one embodiment, an encapsulation compound 650 has a top surfacedisposed in the cavity 622 a to encapsulate the first conductive element610, wherein the top surface 651 of the encapsulation compound 650 andthe exposed portions 622 c of the top surface of the body 622 which arenot covered by the encapsulation compound 650 form a first surface 652,and the first external electrode 632 c and the second external electrode626 are disposed on the first surface 652.

The first conductive element 610 is electrically connected to the firstexternal electrode 632 c via the electrical path encompassing theconductive channel 648 in the circuit substrate 640 and the lead 632,wherein one portion of the lead 632 horizontally penetrates the body 622and another portion of the lead 632 is disposed on the top surface 622 cand the lateral surface 622 d of the body 622. The second conductiveelement 624 is electrically connected to the second external electrode626 via the electrical path outside the body 622 (e.g., a lead). In oneembodiment, the second conductive element 624 can be electricallyconnected to the second external electrode 626 via the electrical pathinside the body 622 (similar to vertical penetration in the body in FIG.3B).

FIG. 6B illustrates a schematic cross-sectional view of example 2. Inone embodiment, the first conductive element 710 is electricallyconnected to the first external electrode 732 c via the electrical pathinside the body 722. Compared with FIG. 6A, the difference between theelectronic package structure 600 and the electronic package structure700 is that a portion of the lead 732 vertically penetrates the body722. The technology of the lead 732 penetrating the body 722 can beperformed by known techniques, such as mechanical drilling or laserthrough-hole, and it can be also applied to the body 722 which is madeby LTCC (low-temperature co-fired ceramics) in particular.

In one embodiment, (refer to FIG. 6A and FIG. 6B again) the firstconductive element is electrically connected to the first externalelectrode via the electrical path inside the body, and the secondconductive element is electrically connected to the second externalelectrode via the electrical path inside the body.

FIG. 6C illustrates a schematic cross-sectional view of example 3. Thesecond conductive element 824 is electrically connected to the secondexternal electrode 826 via the electrical path inside the body 822 andsubstantially parallel to the lateral surface 822 d of the body 822. Theelectrical path can be formed by vertically forming a via 880 topenetrate the body 822. The via 880 can be formed by known techniques,such as mechanical drilling or laser through-hole, and it can be alsoapplied to a body which is made by LTCC (low-temperature co-firedceramics) in particular. The first conductive element 810 iselectrically connected to the first external electrode 832 c via thechannel 848 in the circuit substrate 840. In one embodiment, the firstconductive element 810 can be reversed in the cavity 822 a.

FIG. 6D illustrates a schematic cross-sectional view of example 4. Thesecond conductive element 924 is electrically connected to the secondexternal electrode 926 via the electrical path from the bottom surface922 b, via the lateral surface 922 d, to the top surface 922 c. Comparedwith FIG. 6C, the difference between the electronic package structure800 and the electronic package structure 900 is that the secondconductive element 924 is electrically connected to the second externalelectrode 926 via the electrical path from an interior circuit 980 and alead 990 from the bottom surface 922 b, via the lateral surface 922d, tothe first surface 952.

The following describes a method for manufacturing an electronic packagestructure:

provide a first conductive element, a second conductive element and abody having a top surface with a cavity thereon, wherein the firstconductive element is disposed in the cavity and the second conductiveelement is disposed in the body; form an encapsulation compound in thecavity to encapsulate the first conductive element, wherein theencapsulation compound has a top surface, wherein the top surface of theencapsulation compound and the exposed portions of the top surface ofthe body which are not covered by the encapsulation compound form afirst surface;

and dispose a first external electrode and a second external electrodeon the first surface, wherein the first conductive element iselectrically connected to a first external electrode; and the secondconductive element is electrically connected to a second externalelectrode.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims and their equivalents.

What is claimed is:
 1. An electronic package structure, comprising: afirst conductive element; a magnetic body encapsulating the firstconductive element, wherein the magnetic body comprises a firstprotrusion and a second protrusion on a top surface of the magnetic bodyto form a cavity thereon; a second conductive element disposed in thecavity; an encapsulation compound disposed in the cavity to encapsulatethe second conductive element, wherein the top surface of theencapsulation compound and the exposed portions of the top surface ofthe magnetic body which are not covered by the encapsulation compoundform a first surface; and a plurality of electrodes disposed on thefirst surface, wherein the first conductive element and the secondconductive element are electrically connected to the plurality ofelectrodes.
 2. The electronic package structure as claimed in claim 1,wherein the first conductive element is electrically connected to afirst external electrode of the plurality of electrodes via anelectrical path disposed inside the magnetic body.
 3. The electronicpackage structure as claimed in claim 1, wherein the second conductiveelement is electrically connected to a second external electrode of theplurality of electrodes via an electrical path disposed inside themagnetic body.
 4. The electronic package structure as claimed in claim1, wherein the first conductive element is electrically connected to afirst external electrode of the plurality of electrodes via a firstelectrical path disposed inside the magnetic body; and the secondconductive element is electrically connected to a second externalelectrode of the plurality of electrodes via a second electrical pathdisposed inside the magnetic body.
 5. The electronic package structureas claimed in claim 1, wherein the first conductive element is a coil.6. The electronic package structure as claimed in claim 1, wherein thesecond conductive element is an IC.
 7. The electronic package structureas claimed in claim 1, wherein the first conductive element iselectrically connected to a first external electrode of the plurality ofelectrodes via an electrical path disposed inside the magnetic body andsubstantially parallel to the lateral surface of the magnetic body. 8.The electronic package structure as claimed in claim 1, wherein themagnetic body further comprises a lateral surface, wherein the firstconductive element is electrically connected to a first externalelectrode of the plurality of electrodes via an electrical path from thebottom surface, via the lateral surface, to the first surface.
 9. Theelectronic package structure as claimed in claim 5, wherein the magneticbody comprises a magnetic wrap wrapping the coil.
 10. The electronicpackage structure as claimed in claim 1, wherein the second conductiveelement is electrically connected to a first external electrode via alead frame, wherein the lead frame has a lead having a first end and asecond end, wherein the first end of the lead extends to the cavity forelectrically connecting to the second conductive element; and the secondend of the lead is electrically connected to the first externalelectrode.
 11. The electronic package structure as claimed in claim 1,wherein the first conductive element is an inductor.
 12. The electronicpackage structure as claimed in claim 1, wherein a first electrodeelectrically connected to the first conductive element is disposed onthe top surface of the first protrusion., and a second electrodeelectrically connected to the first conductive element is disposed onthe top surface of the second protrusion.
 13. A method for manufacturingan electronic package structure, the method comprising the steps of:encapsulating a first conductive element by a magnetic body, wherein themagnetic body comprises a first protrusion and a second protrusion on atop surface of the magnetic body to form a cavity thereon; disposing asecond conductive element in the cavity; forming an encapsulationcompound in the cavity to encapsulate the second conductive element,wherein the top surface of the encapsulation compound and the exposedportions of the top surface of the body which are not covered by theencapsulation compound form a first surface; and disposing a firstexternal electrode and a second external electrode on the first surface,wherein the first conductive element is electrically connected to thefirst external electrode; and the second conductive element iselectrically connected to the second external electrode.
 14. Theelectronic package structure as claimed in claim 13, wherein the firstconductive element is a coil.
 15. The electronic package structure asclaimed in claim 13, wherein the second conductive element is an IC.